The basic principle and characteristics of laser micro-cladding

The basic principle of laser micro-cladding technology is to pre-position functional materials (such as micro- and nano-sized powders or slurries) onto functional substrates (fine glass, ceramics, organic epoxy plates, plastics, etc.) by other deposition methods such as micro-pen or micro-spraying. Single crystal silicon and other non-metallic materials), and then use special software, combined with CAD/CAM, to quickly convert the graphics file directly into a processing file, control the laser walking path, and process the functional powder or slurry layer to make the cladding material inside Physical and chemical interactions occur between the cladding layer and the substrate, and wires and passive devices with different line widths are obtained, and the conductive layer, the electric resistance layer and the dielectric layer are directly prepared on the surface of the insulating substrate without a mask.

Laser micro-cladding is characterized by coating various functional electronic, semi-conductor or insulator pastes on the surfaces of various electronic and semiconductor substrates to form desired functional coatings. It enables rapid manufacturing of (micro)electronic components, optoelectronic devices, hybrid integrated circuit substrates, and micro-electromechanical systems. It has the advantages of high processing precision, good quality, easy realization of plane and three-dimensional processing, high flexibility, wide application range of substrates, etc. It has a broad market prospect in the fields of electronics manufacturing, precision machinery and bioengineering.