Wave soldering refers to the melting of solder (tin silver copper alloy), the electric pump or electromagnetic pump jet into the design requirements of the solder peak, but also by injecting nitrogen into the solder pool to form, so pre-equipped with components Of the printed circuit board through the solder wave peak, to achieve soldered ends or pins and printed circuit board pad mechanical and electrical connection between the soldering.

Working principle

1, wave soldering refers to the molten solder by electromagnetic pump or electromagnetic pump jet into the design requirements of the solder peak, the solder peak can also be injected into the solder pool of nitrogen to form, so pre-equipped with printed components The board passes the solder wave crest, realizing the mechanical and electrical connection between the soldered end or pin of the component and the printed circuit board pad.

2, the wave soldering process: the components into the corresponding hole components → pre-coated flux → pre-drying temperature 90-100 ℃ (length 1-1.2m) → wave soldering 220-240 ℃ → remove redundant plug feet → check.

3, the earliest wave soldering process uses tin-lead alloy, but the lead is a heavy metal, the human body and the environment have a great deal of harm, as people's awareness of environmental protection, and now the vast majority of electronic products using a welding without Lead process, the use of solder for the "tin silver copper alloy," and the use of special flux, welding temperature is also higher.

Product introduction

1. Open-capped streamlined shell design, beautiful appearance, easy to clean.

2. Soldering pot made of alloy materials. High strength and hardness of special aluminum rails, long service life.

3. Using text control panel + Mitsubishi PLC control technology to ensure system reliability and stability.

4. Patented stepper motor to move the spray device, moving speed and width can be automatically adjusted with the width of the PCB, effectively saving the flux.

5. Soldering pot wave frequency electronic speed control, can independently control the peak height.

6. Isolated devices, flux fumes discharged from the exhaust and recovery channels to meet the environmental requirements.

7. Users can set their own automatic on-off date, time, temperature control parameters.

8. With cooling module, temperature compensation module, suitable for lead-free and a variety of process requirements.

9. Imported mini chemical pump, propanol cleaner, automatic cleaning chain claws.

10. Powerful preheating system, high heat radiation, rapid heating, modular design, easy to clean.

11. Three independent preheating, ceramic heating tube device, fully stimulate the flux activity, good welding effect. Direct heat radiation to the bottom of the PCB board, fever, long life.

12. Patent die-casting titanium alloy claw, non-stick tin, will not be deformed, long life, transport PCB stable and reliable.

13. Full transparent observation window, easy to observe the production and maintenance operations.

14. Soldering pot manually move in and out, easy to adjust. Back-style design, to prevent misuse damage to the machine

15. Transportation system uses stepless electronic speed control, PID closed-loop control, transport speed and stability.

16. Can quickly recall the stored parameters, operating variables set in the PCB process consistency

17. Automatic plate wave, minimizing the amount of tin oxide.

18. Temperature control system uses PID closed-loop control, temperature control is stable and reliable. With short circuit and over current protection system

19. Operating system has a large memory window program, the automated production to a higher level.